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CR - IDC / Wire to Board

Wire to Board /  CR - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness0.8 to 1.6 mm
Current rating1A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating100V AC, DC
Compliant with rohs

This connector is suitable for interconnection of UL1007 electric wires in aThis connector is suitable for interconnection of UL1007 electric wires in a wide range of electrical and electronic equipment such as TVs.Folded beam double-leaf contact construction.Twin U-slot ID section. The same shrouded header can be used for the KR/KRD insulation displacement connectors or the PH crimp style connector.

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