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CR - IDC / Wire to Board

Wire to Board /  CR - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness0.8 to 1.6 mm
Current rating1A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25°C to 85°C
Voltage rating100V AC, DC
Number of circuits2 to 12
Applicable wireAWG #26
Compliant with rohs

This connector is suitable for interconnection of UL1007 electric wires in aThis connector is suitable for interconnection of UL1007 electric wires in a wide range of electrical and electronic equipment such as TVs.Folded beam double-leaf contact construction.Twin U-slot ID section. The same shrouded header can be used for the KR/KRD insulation displacement connectors or the PH crimp style connector.

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