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ZR - IDC / Wire to Board

Wire to Board /  ZR - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch1.5 mm
Smtno

Spécifications

Applicable pc board thickness0.6 to 1.2 mm, 1.6 mm
Current rating0.7A AC, DC
Insulation resistance500 MOhms min.
Temperature range-25°C to 85°C
Voltage rating50V AC, DC
Number of circuits2 to 13
Applicable wireAWG #30, #28
Compliant with rohs


Twin U-slot ID section
Fully shrouded header
The same shrouded header can be used for the ZH crimp style connector.

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