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ZA - IDC / Wire to Board

Wire to Board /  ZA - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch1.5 mm
Smtno

Spécifications

Applicable pc board thickness0.6 to 1.2 mm
Current rating0.7A AC, DC
Insulation resistance500 MOhms min.
Temperature range-25øC to 85øC
Voltage rating50V AC, DC
Number of circuits2 to 13
Applicable wireAWG #30, #28
Compliant with rohs


Twin-slot ID section
Insulation barrel construction The insulation barrel located between the twin slots firmly grips the wire and protects it from movements due to the heat of soldering or due to handling right after soldering.

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