ZA - IDC / Wire to Board

Wire to Board /  ZA - Schema

Product profile

ConnectorWire to Board
TechnologyInsulation displacement
Pitch1.5 mm


Applicable pc board thickness0.6 to 1.2 mm
Current rating0.7A AC, DC
Insulation resistance500 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating50V AC, DC
Compliant with rohs

Twin-slot ID section
Insulation barrel construction The insulation barrel located between the twin slots firmly grips the wire and protects it from movements due to the heat of soldering or due to handling right after soldering.

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