XAF - IDC / Wire to Board

Wire to Board /  XAF - Schema

Product profile

ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.5 mm


Current rating3A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-40øC to 105øC
Voltage rating150V AC, DC
Number of circuits2 to 20
Compliant with rohs

IDC socket connector compatible with the existing XA crimp housing connector (plug housing). The dipping, SMT & high box type headers or the receptacle housing used for WTW connection can be prepared as the mated counterpart of XAF connector, & the wide range of connection style can be provided depending on the application. Secure locking structure. Low Insertion Force. Insertion guide mechanism. Metallic strain relief. Retainer with 4 locking points. Interchangeability.

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