XAF - IDC / Wire to Board

Wire to Board /  XAF - Schema

Product profile

ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.5 mm


Current rating3A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-40 to +105 Celsius degrees
Voltage rating150V AC, DC
Compliant with rohs

IDC socket connector compatible with the existing XA crimp housing connector (plug housing). The dipping, SMT & high box type headers or the receptacle housing used for WTW connection can be prepared as the mated counterpart of XAF connector, & the wide range of connection style can be provided depending on the application. Secure locking structure. Low Insertion Force. Insertion guide mechanism. Metallic strain relief. Retainer with 4 locking points. Interchangeability.

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