Product profile
| Application | Connectors |
| Connector | Wire to Board |
| Technology | Crimp |
| Pitch | 2.5 mm |
| Smt | no |
Spécifications
| Applicable pc board thickness | 1.6 mm |
| Current rating | 3A AC, DC |
| Insulation resistance | 1000 MOhms min. |
| Temperature range | -25 to + 85 Celsius degrees |
| Voltage rating | 250V AC, DC |
| Compliant with rohs |
Double-row construction
Header wafer is made of solder crack preventive material, glass-filled PA66 nylon.
Secure locking device prevents accidental disconnection.
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