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XA HIGH BOX - Connectors / Wire to Board / Potting

Wire to Board /  XA High box - Schema

Product profile

ApplicationConnectors
ConnectorWire to Board
FamilytypePotting
TechnologyCrimp
Pitch2.5 mm
Smtno

Spécifications

Applicable pc board thickness1.6 mm
Current rating3A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Number of circuits2 to 15
Applicable wireAWG #28 to #22
Hand toolWC-692 / YRS-692
Crimping pressAP-KN21MJ
Compliant with rohs

The header is tall and fully shrouded so as to prevent the resinThe header is tall and fully shrouded so as to prevent the resin used to coat the PC board coming into contact with the mating pins. Designed for use specifically with resin coated (potPotting type."

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