VR - IDC / Wire to Board

Wire to Board /  VR - Schema

Product profile

ConnectorWire to Board
TechnologyInsulation displacement
Pitch3.96 mm


Applicable pc board thickness0.8 to 1.6 mm
Current rating7A AC, DC
Insulation resistance1000 MOhms min.
Voltage rating250V AC, DC
Number of circuits2 to 15
Applicable wireAWG #26, #24, #22, #20, #18
Compliant with rohs

Since the connector can accommodate AWG #18 wires and has a large pitch, it is ideal for connecting power supply circuits.
This receptacle can be used for both daisy chain (through) connections and end connections.
Twin U-slot ID section

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