SZN - IDC / Wire to Board

Product profile

Application	IDC
Connector	Wire to Board
Technology	Crimp
Pitch	1.5 mm
Smt	no

Spécifications

Applicable pc board thickness	0.6 to 1.2 mm
Current rating	0.7A AC, DC
Insulation resistance	500 MOhms min.
Temperature range	-25 to + 85 Celsius degrees
Voltage rating	50V AC, DC
Compliant with rohs

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This low-profile, board-in connector, with a mounting height of only 4.25mm and a thickness of 2.4mm, is soldered directly onto PC boards.

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Production site

J.S.T. FRANCE S.A.S.
Z.I. Vitry Marolles B.P. 60023
51301 Vitry le François
FRANCE
Adresse email : jst@jst.fr
Tél +33 (0)3 26 72 45 03

Our certifications

Presentation from the company

JST France, electronic components manufacturer, was established in Vitry-le-François in 1989. Our plant is composed of 3 machine shops (molding, assembly and stamping) and an industrialization department. This allows us to be closer from our French customers and main European decision-makers.
We produce over-molding housings, connectors and harnesses, mainly for automotive sector. We are certified ISO/TS16949 in order to meet partners' quality requirements and to satisfy their needs. Among our electric components, we can put forward a wide variety of innovative catalog products and crimping tools: FFC/FPC connectors (insertion strength zero, no ZIF), to crimp/crossing, SMT/CMS (surface mounting), insulation displacement (IDC), board to board, board to wire, wire to wire, LED, waterproof, pitch from 0.1 to 13mm, hand tools, semi-automatic presses and applicators for all our crimp contacts.
We can also provide you with a wide range of crimp terminals (Faston, insulated, tubular, rolled/brazed, etc.), cable ends and the corresponding electric tools.