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SGN - IDC / Wire to Board

Wire to Board /  SGN - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyCrimp
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness1.2 to 1.6 mm
Current rating2A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Number of circuits8, 13 & 14
Applicable wireAWG #28 to #24
Crimping pressAP-KN21MJ
Compliant with rohs

A dimension of 2.0mm pitch, 4.0mm mounting height and 2.9mm depth. This board-in type connector will enhance the mounting deA dimension of 2.0mm pitch, 4.0mm mounting height and 2.9mm depth. This board-in type connector will enhance the mounting dens

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