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SAN - IDC / Wire to Board

Wire to Board /  SAN - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyCrimp
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness1.2, 1.6 mm
Current rating2A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Number of circuits2 to 15
Applicable wireAWG #30 to #24
Hand toolWC-220 / YRS-220
Crimping pressAP-KN21MJ
Compliant with rohs

This multi-circuit board-in connector meets the needs for high-density mounting on PC boards efficiently and economically.

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