Product profile
| Application | Connectors |
| Connector | Wire to Board |
| Technology | Crimp |
| Pitch | 2.0 mm |
| Smt | no |
Spécifications
| Current rating | 3A AC, DC |
| Insulation resistance | 1000 MOhms min. |
| Temperature range | -25°C to 85°C |
| Voltage rating | 250V AC, DC |
| Number of circuits | 8 to 42 |
| Applicable wire | AWG #28 to #22 |
| Hand tool | WC-1090 / WC-1091 - YRS-1090 / YRS-1091 |
| Crimping press | AP-KN21MJ |
| Compliant with rohs |
This connector is the high-density dipping type connector with secure lock for wire to board connection and enabled to achieve excellent workability and withstand the unexpected external force.
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