Product profile
| Application | Connectors |
| Connector | Wire to Board |
| Technology | Crimp |
| Pitch | 2.0 mm |
| Smt | no |
Spécifications
| Current rating | 3A AC, DC |
| Insulation resistance | 1000 MOhms min. |
| Temperature range | -25°C to 85°C |
| Voltage rating | 250V AC, DC |
| Number of circuits | 8 to 42 |
| Applicable wire | AWG #28 to #22 |
| Hand tool | WC-1090 / WC-1091 - YRS-1090 / YRS-1091 |
| Crimping press | AP-KN21MJ |
| Compliant with rohs |
This connector is the high-density dipping type connector with secure lock for wire to board connection and enabled to achieve excellent workability and withstand the unexpected external force.
Description filter
40 références
To order sample, you must LOG IN
More information
use contact form
