Product profile
| Application | IDC |
| Connector | Wire to Board |
| Technology | Insulation displacement |
| Pitch | 2.0 mm |
| Smt | no |
Spécifications
| Applicable pc board thickness | 1.6 mm |
| Current rating | 1A AC, DC |
| Insulation resistance | 1000 MOhms min. |
| Temperature range | -25 to + 85 Celsius degrees |
| Voltage rating | 250V AC, DC |
| Applicable panel thickness | 0.5 to 2.0mm |
| Compliant with rohs |
The first insulation displacement connector that has secure locking device.
SecThe first insulation displacement connector that has secure locking device.
Secure locking device prevents accidental disconnection.
Secondary retainers .The PAF connector receptacle has metal strain relieves to hold the wire insulation so that the external forces such as vibration or shock do not directly affect the ID section.
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