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PAF - IDC / Wire to Board

Wire to Board /  PAF - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness1.6 mm
Current rating1A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25°C to 85°C
Voltage rating250V AC, DC
Number of circuits2 to 16
Applicable wireAWG #26
Applicable panel thickness0.5 to 2.0mm
Compliant with rohs

The first insulation displacement connector that has secure locking device.
SecThe first insulation displacement connector that has secure locking device.
Secure locking device prevents accidental disconnection.
Secondary retainers .The PAF connector receptacle has metal strain relieves to hold the wire insulation so that the external forces such as vibration or shock do not directly affect the ID section.

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