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KR - IDC / Wire to Board

Wire to Board /  KR - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.0 mm
Smtno

Spécifications

Current rating1A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating100V AC, DC
Applicable panel thickness0.8 to 1.6mm
Compliant with rohs


Folded beam double-leaf contact construction
Twin U-slot ID section
The same shrouded header can be used for the CR/KRD insulation displacement connectors or the PH crimp style connector.

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