JFA J300 (W TO W 5.08) - Connectors / Wire to wire

Wire to wire /  JFA J300 (W to W 5.08) - Schema

Product profile

ConnectorWire to wire
Pitch5.08 mm


Applicable pc board thickness1.6 to 2.4 mm
Current rating18A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-55°C to 105°C
Voltage rating600V AC, DC
Number of circuits6, 8, 10, 12, 16 & 20
Applicable wireAWG #28 to #14
Hand toolYRF-881
Crimping pressAP-KN21MJ
Compliant with rohs

Available in both wire-to-board and wire-to-wire connection, the JFA connector is applicable to a wide range of applications e.g. from signal to output circuits.
Double-spring construction to achieve superior contact reliability the socket contact.

Description filter

16 références

To order sample, you must LOG IN
More information use contact form