Product profile
| Application | Connectors |
| Connector | Wire to wire |
| Technology | Crimp |
| Pitch | 5.08 mm |
| Smt | no |
Spécifications
| Applicable pc board thickness | 1.6 to 2.4 mm |
| Current rating | 18A AC, DC |
| Insulation resistance | 1000 MOhms min. |
| Temperature range | -55 to +105 Celsius degrees |
| Voltage rating | 600V AC, DC |
| Compliant with rohs |
Available in both wire-to-board and wire-to-wire connection, the JFA connector is applicable to a wide range of applications e.g. from signal to output circuits.
Double-spring construction to achieve superior contact reliability the socket contact.
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