Application | Connectors |
Connector | Board to Board |
Pitch | 2.5 mm |
Smt | no |
Applicable pc board thickness | 1.6 mm |
Current rating | 3A AC, DC |
Insulation resistance | 500 MOhms min. |
Temperature range | -25 to + 85 Celsius degrees |
Voltage rating | 250V AC, DC |
Compliant with rohs |
Used to interconnect PC boards in parallel, vertically or horizontally.
Folded beam construction
Molded-in header