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HR (IDC) - IDC / Wire to Board

Wire to Board /  HR (IDC) - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.5 mm
Smtno

Spécifications

Applicable pc board thickness0.8 to 1.6 mm
Current rating2A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Number of circuits2 to 15
Applicable wireAWG #28, #26, #24
Head adaptatorIDH-KR20
Pistol toolIDB-12
Compliant with rohs


Thin design
Twin U-slot ID section
The same shrouded header can be used for the EH or HR crimp style connector.

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