Application | FFC/FPC |
Connector | Wire to Board |
Familytype | For FFC/FPC |
Technology | NON-ZIF |
Pitch | 1.25 mm |
Smt | no |
Applicable pc board thickness | 1.2 to 1.6 mm |
Current rating | 1A AC, DC |
Insulation resistance | 1000 MOhms min. |
Temperature range | -25 to + 85 Celsius degrees |
Voltage rating | 200V AC, DC |
Compliant with rohs |
Low insertion force and high contact pressure
The FFC is s
Low insertion force and high contact pressure
The FFC is securely connected by simply inserting their leads into the connector.
The contact's solder dip section has a retention mechanism.
All our products |
Production siteJ.S.T. FRANCE S.A.S. Our certificationsPresentation from the companyJST France, electronic components manufacturer, was established in Vitry-le-François in 1989. Our plant is composed of 3 machine shops (molding, assembly and stamping) and an industrialization
department. This allows us to be closer from our French customers and main European decision-makers. © 2024 JST |Conditions générales de vente | | Supplier Quality Charter | Lien 2 Site developed by KerniX |