| Application | FFC/FPC | 
| Connector | Wire to Board | 
| Familytype | For FFC/FPC | 
| Technology | NON-ZIF | 
| Pitch | 1.25 mm | 
| Smt | no | 
| Applicable pc board thickness | 1.2 to 1.6 mm | 
| Current rating | 1A AC, DC | 
| Insulation resistance | 1000 MOhms min. | 
| Temperature range | -25 to + 85 Celsius degrees | 
| Voltage rating | 200V AC, DC | 
| Compliant with rohs | |
Low insertion force and high contact pressure 
The FFC is s
Low insertion force and high contact pressure 
The FFC is securely connected by simply inserting their leads into the connector. 
The contact's solder dip section has a retention mechanism.
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          Production siteJ.S.T. FRANCE S.A.S. Our certifications  Presentation from the companyJST France, electronic components manufacturer, was established in Vitry-le-François in 1989. Our plant is composed of 3 machine shops (molding, assembly and stamping) and an industrialization
department. This allows us to be closer from our French customers and main European decision-makers. © 2025 JST |Conditions générales de vente | | Supplier Quality Charter | Lien 2 Site developed by KerniX  |