FDZ - FFC/FPC / Wire to Board / For FFC/FPC

Product profile

Application	FFC/FPC
Connector	Wire to Board
Familytype	For FFC/FPC
Technology	ZIF
Pitch	2.54 mm
Smt	no

Spécifications

Applicable pc board thickness	1.6 mm
Current rating	1A AC, DC
Insulation resistance	1000 MOhms min.
Temperature range	-40 to +85 Celsius degrees
Voltage rating	250V AC, DC
Compliant with rohs

Download specifications

Double-sided contact
The contact solder tail has a board retention feature that allows the connector to be temporarily held on the PC board while it is being soldered.

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Production site

J.S.T. FRANCE S.A.S.
Z.I. Vitry Marolles B.P. 60023
51301 Vitry le François
FRANCE
Adresse email : jst@jst.fr
Tél +33 (0)3 26 72 45 03

Our certifications

Presentation from the company

JST France, electronic components manufacturer, was established in Vitry-le-François in 1989. Our plant is composed of 3 machine shops (molding, assembly and stamping) and an industrialization department. This allows us to be closer from our French customers and main European decision-makers.
We produce over-molding housings, connectors and harnesses, mainly for automotive sector. We are certified ISO/TS16949 in order to meet partners' quality requirements and to satisfy their needs. Among our electric components, we can put forward a wide variety of innovative catalog products and crimping tools: FFC/FPC connectors (insertion strength zero, no ZIF), to crimp/crossing, SMT/CMS (surface mounting), insulation displacement (IDC), board to board, board to wire, wire to wire, LED, waterproof, pitch from 0.1 to 13mm, hand tools, semi-automatic presses and applicators for all our crimp contacts.
We can also provide you with a wide range of crimp terminals (Faston, insulated, tubular, rolled/brazed, etc.), cable ends and the corresponding electric tools.