DIM - Card Edge / Board to Board / S.O.DIMM

Board to Board /  DIM - Schema

Product profile

ApplicationCard Edge
ConnectorBoard to Board
Pitch0.6 mm


Current rating0.3A AC, DC
Insulation resistance250 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating25V AC, DC
Compliant with rohs

Socket for DDR/DDR3 S.O.DIMM 204- circuit complying with JEDEC (MO-268). Hold the PC board by the mechanism for preventing to come off the PC board. Mechanism for preventive incomplete mating to check by visual from upper, & right & left is provided.

Description filter

2 références

To order sample, you must LOG IN
More information use contact form