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DD/DS - IDC / Wire to Board

Wire to Board /  DD/DS - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness0.8, 1.0, 1.2, 1.6 mm
Current rating0.7A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25°C to 85°C
Voltage rating100V AC, DC
Number of circuits2 to 15
Applicable wireAWG #28
Compliant with rohs


Compact and low profile Compliant locking solder tails
Twin U-slot ID section
Strain relief

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