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SZN - IDC / Wire to Board

Wire to Board /  SZN - Schema

Profil de produit

ApplicationIDC
ConnectorWire to Board
TechnologyCrimp
Pitch1.5 mm
Smtno

Spécifications

Applicable pc board thickness0.6 to 1.2 mm
Current rating0.7A AC, DC
Insulation resistance500 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating50V AC, DC
Compliant with rohs

This low-profile, board-in connector, with a mounting height of only 4.25mm and a thickness of 2.4mm, is soldered directly onto PC boards.

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