Product profile
| Application | Connectors |
| Connector | Wire to Board |
| Familytype | Potting |
| Technology | Crimp |
| Pitch | 2.5 mm |
| Smt | no |
Spécifications
| Applicable pc board thickness | 1.6 mm |
| Current rating | 3A AC, DC |
| Insulation resistance | 1000 MOhms min. |
| Temperature range | -25øC to 85øC |
| Voltage rating | 250V AC, DC |
| Applicable wire | AWG #30 to #22 |
| Hand tool | YRS-480 |
| Crimping press | AP-KN21MJ |
| Semi-automatic applicator | MINI KB1T SXH002-J |
| Compliant with rohs |
| Colored |
The header is tall and fully shrouded so as to prevent the resin used to coat the PC board coming into contact with the mating pins. Designed for use specifically with resin coated (potted") PC boards.
The header is a designed to accept XHPotting type."
Description filter
10 références
To order sample, you must LOG IN
More information
use contact form
