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XAD (W TO B) - Connectors / Wire to Board

Wire to Board /  XAD (W to B) - Schema

Product profile

ApplicationConnectors
ConnectorWire to Board
TechnologyCrimp
Pitch2.5 mm
Smtno

Spécifications

Applicable pc board thickness1.6 mm
Current rating3A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Applicable wireAWG #28 to #20
Hand toolWC-700M/YRS-701
Crimping pressAP-KN21MJ
Semi-automatic applicatorMINI KB1T SXA01-J
Compliant with rohs
Colored


Double-row construction
Header wafer is made of solder crack preventive material, glass-filled PA66 nylon.
Secure locking device prevents accidental disconnection.

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