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SDN - Connectors / Wire to Board

Wire to Board /  SDN - Schema

Product profile

ApplicationConnectors
ConnectorWire to Board
TechnologyCrimp
Pitch3.96 mm
Smtno

Spécifications

Applicable pc board thickness1.6 mm
Current rating7A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Applicable wireAWG #22 to #18
Hand toolYC-600R
Crimping pressAP-KN21MJ
Semi-automatic applicatorMINI KB1T SDN-21T-P1.5-J
Compliant with rohs

This board-in connector is capable of connecting a wide variety of circuits including signal and power supply circuits. The connector features a slim, low-profile design.

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