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RF - Connectors / Wire to Board

Wire to Board /  RF - Schema

Product profile

ApplicationConnectors
ConnectorWire to Board
TechnologyCrimp
Pitch2.54 mm
Smtno

Spécifications

Applicable pc board thickness1.2 to 1.6 mm
Current rating2A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-55øC to 105øC
Voltage rating250V AC, DC
Applicable wireAWG #30 to #24
Hand toolYRM-230
Crimping pressAP-KN21MJ
Semi-automatic applicatorMINI KB1T RF-SC22**-J
Compliant with rohs

Well suited for completing the internal connections of office automation equipment, such as personal computers, office computers, and their peripheral devices.
Double-leaf spring contact withstands the stresses caused by repeated mating and unmating

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