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PND - Connectors / Wire to Board

Wire to Board /  PND - Schema

Product profile

ApplicationConnectors
ConnectorWire to Board
TechnologyCrimp
Pitch2.0 mm
Smtno

Spécifications

Current rating3A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Applicable wireAWG #28 to #22
Hand toolWC-1090 / WC-1091 - YRS-1090 / YRS-1091
Crimping pressAP-KN21MJ
Semi-automatic applicatorMINI KB1T SPND-00*T-C0.5-J
Compliant with rohs
Colored

This connector is the high-density dipping type connector with secure lock for wire to board connection and enabled to achieve excellent workability and withstand the unexpected external force.

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