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PAL - Connectors / Wire to wire

Wire to wire /  PAL - Schema

Product profile

ApplicationConnectors
ConnectorWire to wire
TechnologyCrimp
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness1.6 mm
Current rating1A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Applicable wireAWG #26
Applicable panel thickness0.5 to 2.0mm
Hand toolPCR-04AB
Crimping pressAP-KN21MJ
Semi-automatic applicatorMINIKB1T FINE ADJ SPAL001T-06-J/MINIKB1T FINE ADJ SPAL-002T-06-J
Compliant with rohs
Colored

Applicable to both crimp and insulation displacement style receptacles. Secure locking device prevents accidental disconnection. Secondary retainers provide added protection against incomplete insertion or disconnection. Panel locking type

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