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PAD - Connectors / Wire to Board

Wire to Board /  PAD - Schema

Product profile

ApplicationConnectors
ConnectorWire to Board
TechnologyCrimp
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness1.6 mm
Current rating3A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25øC to 85øC
Voltage rating250V AC, DC
Applicable wireAWG #28 to #22
Hand toolWC-1091/YRS-1091 =002T
Crimping pressAP-KN21MJ
Semi-automatic applicatorMINI KB1T SPNI-001T-P05-J/MINI KB1T SPND-001T-C05-J
Compliant with rohs
Colored

2.0mm pitch double-row connector with secure locking device
Secure locking device The housing has a locking device to securely hold the header, preventing accidental disconnection because of external forcesthat might result from the routing of wires during assembly process oe of vibration.

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