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JFA J300 (W TO W 5.08) - Connectors / Wire to wire

Wire to wire /  JFA J300 (W to W 5.08) - Schema

Product profile

ApplicationConnectors
ConnectorWire to wire
TechnologyCrimp
Pitch5.08 mm
Smtno

Spécifications

Applicable pc board thickness1.6 to 2.4 mm
Current rating18A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-55øC to 105øC
Voltage rating600V AC, DC
Applicable wireAWG #28 to #14
Hand toolYRF-881
Crimping pressAP-KN21MJ
Semi-automatic applicatorMINIKB1T SF3F/M**-J
Compliant with rohs

Available in both wire-to-board and wire-to-wire connection, the JFA connector is applicable to a wide range of applications e.g. from signal to output circuits.
Double-spring construction to achieve superior contact reliability the socket contact.

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