Ouvrir/Fermer
 
  Back  
 

HR (IDC) - IDC / Wire to Board

Wire to Board /  HR (IDC) - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.5 mm
Smtno

Spécifications

Applicable pc board thickness0.8 to 1.6 mm
Current rating2A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating250V AC, DC
Compliant with rohs


Thin design
Twin U-slot ID section
The same shrouded header can be used for the EH or HR crimp style connector.

Description filter

 
22 références

To order sample, you must LOG IN
More information use contact form