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FDZ - Connectors / Wire to Board / For FFC/FPC

Wire to Board /  FDZ - Schema

Product profile

ApplicationConnectors
ConnectorWire to Board
FamilytypeFor FFC/FPC
TechnologyZIF
Pitch2.54 mm
Smtno

Spécifications

Applicable pc board thickness1.6 mm
Current rating1A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-40øC to 85øC
Voltage rating250V AC, DC
Compliant with rohs


Double-sided contact
The contact solder tail has a board retention feature that allows the connector to be temporarily held on the PC board while it is being soldered.

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