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DR - IDC / Wire to Board

Wire to Board /  DR - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness1.2 to 1.6 mm
Current rating1A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating100V AC, DC
Compliant with rohs


Low profile 5.0mm in mounting height.
Twin U-slot ID section
Folded beam double-leaf contact construction

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