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CK - IDC / Wire to Board

Wire to Board /  CK - Schema

Product profile

ApplicationIDC
ConnectorWire to Board
TechnologyInsulation displacement
Pitch2.0 mm
Smtno

Spécifications

Applicable pc board thickness0.8 to 1.6 mm
Current rating2A AC, DC
Insulation resistance1000 MOhms min.
Temperature range-25 to + 85 Celsius degrees
Voltage rating100V AC, DC
Compliant with rohs

Multi-harness of CK connector(2.0mm) and CZ connector(1.5mm) combination has been realized.

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